Application
Cell phone motherboard
laptop motherboard
LED lamp beads
Electronic components
Packaged components
Earphone module
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Name
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QTY(Pcs)
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Remark
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80KV-10um close X Tube
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1
|
|
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Object Stage
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1
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Size:250*250MM
|
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Flat Panel Detector
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1
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Full digital HD
|
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Image processor CPU
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1
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Fully functional
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|
Liquid crystal display
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1
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24"
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Full Automatic BGA Testing Procedures
1. A simple mouse click programming without the need for operator intervention on the component can detects each BGA automatically.
2. Automatic BGA test, accurately check the bridge, Welding, cold welding and void ratio of BGA.
3. Automatic BGA test repeatable test results in order to process control
4. The test results will be displayed on the screen and can be output to Excel to facilitate review and archiving
NC Programming
1.A simple mouse clicks operation write test procedures
2.The stage can be X, Y director positioning; X-ray tube and detector Z positioning.
3.Software setting voltage and current
4.Image settings: brightness, contrast, auto gain and exposure
5.The user can set the program switch pause time
6.Anti-collision system can meet the maximum tilt and observe objects
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1
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X-RAY launch tube
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Tube type
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Closed X-ray tube
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Maximum tube voltage
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80KV(90kV,100kV，110kV,120kV optional)
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Maximum tube current
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0.5mA
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Focal size
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10um
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Magnification
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Geometric magnification: 50
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System magnification: 300X
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2
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Detector
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Image speed
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35fps
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Detector
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1124*1000
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Tilt angle
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Probe 30 ° tilt
|
|
3
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Cabinet Specifications
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Stage size
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250mm*250mm
|
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Cabinet Specifications
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260kg
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Dimensions
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600mm*600mm*800mm
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Cabinet Specifications
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AC 110-220V（+10%）(international standard power supply)
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|
4
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X-ray leakage amount
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≤1 u Sv/h
|
|
5
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operating system
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Windows 7
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Typical X-Ray Applications:
1> 2D imaging
2> Color image
3>Circuit Board Inspection.Circuit board testing automated testing of BGA welding area, bubbles and air (Open), short circuits, offset, round, Tin lost the ball.
Bridging, standard BGA bridge (cause: solder paste too much solution: check the press machine)
Cold Solder, Standard BGA Cold Welding (Possible Cause: No Melting Temperature Solution: Check Reflow )
Check the solder paste, BGA open (Possible reasons: solder printing problems, solder missing, poor solderability. Solution: Check the press)
4>Semi-Conductor,Internal wire bonding inspecetion
5>Inspection ofinternal part of a capacitor.
6> Lithium battery detection.Measuring the distance between the cathode and cathode of the lithium battery
7>Detection of electric heating tube
Check the quality of the resistance wire inside the heating tube
