Ormecon immersion tin is a method for chemical tin plating of copper surfaces.
The special on Ormecon process is a 0.08 micron thick layer of organic metal, which optimally prepares the surface for subsequent tinning and then prevents the 'diffusion of copper through the tin.
Ormecon ® CSN meets all modern requirements for PCBs:
- completely planar surfaces for SMD technology
- high storage capacity of bare printed circuit board
- Energy and cost savings compared to HASL
- can be used in basket systems without a major investment
- suitable for horizontal production lines
- protects the environment
- simple process control and monitoring
- all common solder and assembly print varnishes are processed
Additionally Ormecon ® CSN offers the following advantages over other chemical-tin methods:
- Deposition of pure tin
- Up to 50% longer service life of the tin bath
- significant reduction of the diffusion layer
- protection against oxidation • mulitiple, including interim storage, possible
- Rating: 4 hours ageing 155 ° C, 3 x reflow, 1 x Shaft
Equipment:
PROTEC 2030
PROTEC is ideally suited to the Ormecon chemical tinning procedure. The standard machine can process plates up to 200 x 300mm and contains 5 pools for Microetch, combined spray- and static rinse , Organic metal, chemical tinning 7001, hot rinse
Additional options:
Plate size 300 x 400mm
Bath movement
Pools for Cleaning Step
Pool for DI rinse
further links:
-> Compacta 30
-> Compacta 40
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-> Compacta Ni-Au
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